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Government approves four new Semiconductor Projects in Odisha, Punjab and Andhra Pradesh

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Our Bureau

New Delhi

This Tuesday, on August 12th, the Union Cabinet has given a green flag for four new semiconductor projects in Odisha, Punjab and Andhra Pradesh. These new semiconductor projects will be worth somewhere around Rs 4,594 crore.

India’s revolutionary Semiconductor mission which sat at a total of 6 projects approved by the central government will now be heading 10 projects. The total investments made on these projects is worth somewhere around Rs.1.6 lakh crore, as per the union minister of Electronics and IT ministry Ashwini Vishnaw. The four new projects will generate heavy revenue and employment as well, as per the reports it is expected that around 2034 professionals will be involved in the projects.

Two of these 4 new projects will be based in Odisha’s capital Bhubaneswar, one will be based in Punjab’s Mohali and one in Andhra Pradesh. Bhubaneswar will have a compound semiconductor and an advanced packaging unit while Mohali will be welcoming an expansion to their CDIL facility. On the other hand, Andhra Pradesh is set to be home to its first semiconductor manufacturing unit.

The Silicon Carbide Semiconductor Plant in Bhubaneshwar has been approved by the government with a total investment of Rs 2,066 crore. This will be the first commercial compound fab in the country and will be built from a collaborative effort from SicSem Pvt. is collaborating with Clas-SiC Wafer Fab Ltd., UK.

The Advanced Packaging And Embedded Glass Substrate Unit will be the second project based in Odisha’s capital. It will be a vertically integrated advanced packaging and embedded glass substrate unit which will be built at a total cost of Rs.1943 Crore. The investments will be made from intel, venture capital funds, Lockheed Martin and other private equity funds.

The Chip Plant will be based in Punjab’s Mohali. It is expected to cost less than other projects with a total investment of Rs.117 crore. It will manufacture high power discrete semiconductor devices both in silicon and silicon carbide.

The Chip packaging unit will be based in Andhra Pradesh and will be worth around Rs.468 crore. It will be set up by an advanced system in package technologies in state.

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