Samsung Electronics and Dutch semiconductor equipment maker ASML have expanded their strategic partnership to accelerate the development of next-generation semiconductor manufacturing technologies, with a particular focus on High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography. The collaboration comes as demand for advanced chips rises sharply amid the global expansion of artificial intelligence.
Under the expanded partnership, Samsung will join an industry initiative to develop next-generation 12-inch photomask technology, a major shift from the 6-inch format that has been widely used in semiconductor manufacturing. The larger masks are expected to improve manufacturing productivity, reduce chipmaking costs and address limitations associated with stitching multiple exposures together.
Samsung also plans to introduce ASML’s High NA EUV technology into high-volume DRAM manufacturing by 2028, marking what the companies describe as an industry-first adoption for future DRAM production. The technology offers higher resolution, which could help simplify manufacturing processes while improving efficiency and extending the roadmap for increasingly advanced memory chips.
The partnership builds on years of cooperation between the two companies. Samsung’s expertise in memory and foundry manufacturing, combined with ASML’s leadership in advanced lithography equipment, is expected to support the development of smaller, more powerful and energy-efficient semiconductors.
The move also reflects the semiconductor industry’s growing focus on technologies capable of meeting the computing demands created by AI. ASML’s latest High NA EUV systems are designed to enable more advanced chip production, while chipmakers are working to integrate the technology into future manufacturing lines.